2280-logic-element MachXO — 211-I/O BGA for glue-logic consolidation
The Lattice LCMXO2280C-3FTN256C is a MachXO-series FPGA packing 2280 logic elements and 28 Kbit of embedded RAM in a 256-ball FTBGA (17x17 mm). With 211 user I/O, it can absorb a board's worth of discrete 74-series logic, bus muxing, and interface bridging into a single programmable device. Operating temperature is 0°C to 85°C (TJ), the commercial/industrial crossover band that covers most control-room, telecom-cabinet, and test-equipment environments.
Active lifecycle and RoHS3 compliance — no end-of-life watch
The 256-FTBGA package is surface-mount only; the 17x17 mm footprint with 1.0 mm ball pitch is a standard four-layer board layout. Tray packaging means the parts arrive in matrix trays, not tape-and-reel, so pick-and-place feeders need a tray handler or a manual tube adapter.
285 logic blocks and 28 Kbit RAM — what the fabric delivers
The MachXO fabric is organised as 285 LABs/CLBs, each containing four LUT4s and four flip-flops. The 28 Kbit embedded RAM is distributed as EBR blocks (9 Kbit each) plus distributed SPRAM — enough for small FIFOs, register files, or line buffers in a video or serial bridge. The -3 speed grade is the entry-level bin in the MachXO family. For a glue-logic consolidation running at 50-100 MHz system clock, the -3 tier is the cost-optimised choice; the -4 grade (LCMXO2280C-4FTN256C) is electrically and footprint-identical, just a faster timing closure ceiling for designs that need it.