Logic capacity and I/O for glue-logic and bridge designs
The LCMXO2-7000HC-4BG256C packs 6864 logic elements (858 LABs/CLBs) and 206 user I/O in a 256-LFBGA package — enough fabric to absorb moderate glue-logic, bus bridging, or control-plane sequencing without an external CPLD.
The 256-LFBGA (CABGA 14x14 mm) is a fine-pitch BGA — the 0.80 mm ball pitch demands a 4-layer PCB for fan-out; two-layer boards will struggle to route the inner rows. The supplier device package is 256-CABGA (14x14). Surface-mount only; the Tray packaging is standard for production pick-and-place. The 0°C to 85°C (TJ) operating range covers commercial and most industrial ambient environments, though the junction temperature limit means the board's thermal design must keep the die below 85°C under full I/O toggle.
Lattice lists this part as Active — no NRND or EOL flag. ROHS3 compliant, so it passes the EU RoHS recast without exemption issues.