256 logic elements in a 5×5 mm QFN — what fits
The LCMXO2-256ZE-3SG32C is the smallest density member of Lattice's MachXO2 family, packing 256 logic elements (32 LABs/CLBs, each with 8 LUTs) into a 32-UFQFN exposed-pad package measuring 5×5 mm. With 21 user I/O and a single-rail 1.14-1.26 V core supply, this part targets glue-logic consolidation, CPLD replacement, or a boot controller where board real estate is the binding constraint — not gate count. The 0°C to 85°C commercial temperature grade limits it to indoor, non-condensing environments — no industrial or automotive ambient. Surface-mount assembly with the exposed pad requires a soldered ground-plane connection for thermal management; the 0.5 mm pitch QFN demands a 4-layer PCB for reliable fan-out of all 21 I/O plus supply and ground.
ROHS3 compliant, meaning no restricted-substance exemptions that would complicate EU or California market entry. The base product number is LCMXO2-256; the -3SG32C suffix encodes the speed grade (-3), the package (SG32 = 32-QFN), and the temperature range (C = commercial).
Cross-reference check — LCMXO2-256ZE-1SG32I vs this part
The closest peer in the ledger is the LCMXO2-256ZE-1SG32I: same 256 LEs, same 21 I/O, same 32-QFN package, same 1.14-1.26 V supply. A board designed for the -1SG32I will accept the -3SG32C without a PCB change — same footprint, same supply rails — but the commercial temperature ceiling may be a showstopper if the ambient exceeds 85°C.
