Logic density and I/O budget for glue-logic consolidation
The LCMXO2-256HC-4MG132I packs 256 logic elements (32 LABs/CLBs) and 55 user I/O in a 132-ball CSPBGA package — enough to absorb a handful of 74-series glue-logic parts or a small state machine without leaving the BOM footprint of a single IC.
Package and board-fit: 132-CSPBGA
The 132-ball CSPBGA (8x8 mm body) uses a 0.5 mm ball pitch — a standard 4-layer PCB with via-in-pad or microvia fan-out handles the routing. The supplier device package is 132-CSPBGA (8x8). Surface-mount assembly with a standard lead-free reflow profile is expected; the Tray packaging keeps the parts aligned for pick-and-place without tape-and-reel handling damage.
The base product number LCMXO2-256 covers the whole 256-LE slice of the MachXO2 family; the -4 speed grade and HC (high-performance, 3.3 V core) variant are the ones to order for this specific supply and timing window.