1280 logic elements in a 5x5 mm package
The LCMXO2-1200ZE-1SG32I packs 1280 logic elements and 65536 bits of block RAM into a 32-UFQFN package measuring 5x5 mm. The 21 user I/O routes through a 0.5 mm pitch QFN — enough for a small state machine, a bus bridge, or a few serial interfaces in a space-constrained design.
ZE low-power rail and industrial temperature grade
Core supply runs at 1.14V to 1.26V — the ZE variant is the low-power branch of MachXO2, drawing less dynamic current than the HC or HE siblings at the same logic density.
Package and board-fit: 32-QFN with exposed pad
The 32-UFQFN exposed pad (supplier device package 32-QFN) requires a thermal land on the PCB. The 21 I/O fan out on two sides; the remaining two sides carry the supply and configuration pins.
No end-of-life notice, no last-time-buy window — it remains a safe BOM line for new and sustaining production. The MachXO2 family has broad second-source coverage through Lattice's own pin-compatible variants; the 32-QFN package is unique to this density tier, so the footprint locks the board to this specific package size.