1280 logic cells, 79 I/O — density and interface width
The LCMXO2-1200HC-5TG100I packs 1280 logic cells (LUTs) in a 100-TQFP package, giving you 79 user I/O pins to connect to sensors, displays, or a host processor. That cell count lands it in the lower-mid density tier of the MachXO2 family — enough for glue logic, state machines, or a small MCU bus bridge without blowing the BOM on a larger FPGA. On-chip RAM totals 64 Kbit (65536 bits), enough for a small FIFO, coefficient lookup table, or boot-time scratchpad. The 160 logic blocks (LABs/CLBs) give the routing fabric room to pack the design without congestion.
Industrial temp and wide supply — fits harsh and mixed-voltage boards
The 100-TQFP (14x14 mm) package is a standard fine-pitch QFP with 0.5 mm lead pitch. It routes out on a 2-layer board for most designs, though a 4-layer stack-up helps with the core and I/O supply decoupling. The exposed pad on the bottom is not present — thermal management relies on airflow and the board copper.
Active lifecycle and compliance — no end-of-life risk for new designs
The base product number LCMXO2-1200 covers the whole die; the suffix -5TG100I denotes the speed grade (5 = standard), package (TG100 = 100-TQFP), and temperature range (I = industrial). The -4 and -6 speed grades share the same footprint and pinout, so a board spun for this part can accept a faster or slower sibling without a layout change.