ICBOMS

ISSI, Integrated Silicon Solution Inc — Discrete Semiconductors

Turnkey BOM procurement and spot-buy shortage sourcing for ISSI, Integrated Silicon Solution Inc Discrete Semiconductors — 9 part numbers with specifications and

Package / Case
24-TBGA · 64-LBGA · 56-TFSOP (0.724", 18.40mm Width) · 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Supplier Device Package
24-TFBGA (6x8) · 64-LFBGA (9x9) · 56-TSOP I · 8-SOP-EP
Memory Organization
8M x 8 · 32M x 8 · 16M x 8 · 128M x 8
Technology
FLASH · FLASH - NOR · FLASH - NAND (SLC) · SDRAM - Mobile LPDDR4
Clock Frequency
133 MHz · 200 MHz · 1.6 GHz · 933 MHz
Memory Size
64Mbit · 256Mbit · 128Mbit · 1Gbit
Operating Temperature
-40°C ~ 105°C (TA) · -40°C ~ 125°C (TA) · -40°C ~ 85°C (TA) · -40°C ~ 85°C (TC)
Voltage - Supply
2.7V ~ 3.6V · 1.7V ~ 2V · 1.06V ~ 1.17V, 1.7V ~ 1.95V · 1.425V ~ 1.575V

Other manufacturers