Intel EPM7128BFC256-7 — Discrete Semiconductors
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Intel EPM7128BFC256-7 CPLD, 128 macrocells, 7.5 ns

MPN EPM7128BFC256-7
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Intel MAX 7000B CPLD, EPM7128BFC256-7, 128 macrocells, 100 I/O, 7.5 ns tpd, 2.5 V core, 256-BGA, 0°C to 70°C.

In Stock: 6,961 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$31.28 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$31.28
10+ pcs
$28.15
30+ pcs
$25.65
100+ pcs
$23.15
500+ pcs
$21.58
1,000+ pcs
$20.33
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$31.28 / ea

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[SPEC] Essential Parameters Snapshot Full Specifications (12)
Package / Case 256-BGA

Full Technical Specifications

12 Parameters
EPM7128BFC256-7 specifications
Parameter / AttributeSpecification / Value
SeriesMAX® 7000B
MountingSurface Mount
Programmable typeIn System Programmable
Voltage supply - internal2.375V ~ 2.625V
Operating temperature0°C ~ 70°C (TA)
PackageBulk
Number of i (O)100
Case256-BGA
Number of gates2500
Number of macrocells128
Delay time tpd(1) max7.5 ns
Number of logic elements (Blocks)8
Series Sibling Variants

Intel MAX® 7000B Series Models

Sibling variants, package options, and speed/density grades in this Intel semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

128-macrocell CPLD in 256-ball BGA

The Intel EPM7128BFC256-7 is a MAX 7000B CPLD with 128 macrocells organised into 8 logic element blocks, delivering 2500 usable gates for glue-logic, state-machine, and decode functions in a single-chip programmable logic solution. Its 7.5 ns pin-to-pin propagation delay (tpd) means combinatorial signals propagate through the device in under one 133 MHz clock period — fast enough for address decoding, bus arbitration, and control logic in 100 MHz-class processor systems without external wait states. The 100 user I/O pins, each configurable as input, output, or bidirectional, connect directly to the 256-ball BGA's outer rows — the 17×17 mm FBGA footprint (supplier device package 256-FBGA) demands a 4-layer PCB for fan-out of the inner ball rows.

2.5 V core, in-system programmable

The MAX 7000B family supports multiple I/O voltages through VCCIO pins, but the core voltage is fixed at 2.5 V. In-system programmability (ISP) via the JTAG interface means the device can be programmed and reprogrammed after soldering — no UV eraser or socket adapter needed. A standard USB-Blaster or ByteBlaster II cable drives the TCK, TMS, TDI, TDO lines at 3.3 V levels; the core voltage is supplied by the board's 2.5 V regulator. For industrial or automotive temperature ranges, the MAX 7000A or MAX 7000S families in -10 or -15 speed grades are the alternatives.

Active lifecycle, RoHS non-compliant

This part is RoHS non-compliant — the solder balls and internal metallisation contain lead. It is exempt under the RoHS directive's annex for high-reliability and legacy applications, but it cannot be used in new designs requiring full RoHS compliance without an exemption claim. The 256-BGA package is moisture-sensitive; MSL level should be verified from the latest Intel packaging data sheet before the reflow profile is set.

Frequently asked questions

Can EPM7128BFC256-7 be programmed in-system?

Yes, it is in-system programmable via the JTAG interface. A standard USB-Blaster or ByteBlaster II cable connects to the TCK, TMS, TDI, and TDO pins. The core 2.5 V supply must be present on the board during programming.

What is the closest functional equivalent to EPM7128BFC256-7?

The EPM7128AEUC169-7 is a close peer — same 128 macrocells, 100 I/O, and 7.5 ns tpd, but in a 169-ball UBGA package with a 3.0 V core voltage. The package and supply voltage differ, so a board layout change is required. No pin-compatible drop-in replacement exists from Intel.

EPM7128BFC256-7
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