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Intel EP4CE75F29C9L — FPGA / CPLD & Programmable Logic

Intel EP4CE75F29C9L Cyclone IV E FPGA, 75408 LEs, 426 I/O

MPNEP4CE75F29C9L
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Intel Cyclone® IV E FPGA, EP4CE75F29C9L, 75408 logic elements, 426 I/O, 2810880 total RAM bits, 780-BGA package, 0°C to 85°C operating temperature.

$69.0000Ref. price · indicative, final on quote
Intel EP4CE75F29C9L datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE75F29C9L specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Supply voltage0.97V ~ 1.03V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)426
Case780-BGA
Total RAM bits2810880
Number of LABs (CLBs)4713
Number of logic elements (Cells)75408

Product details

75408 logic elements in a 780-BGA footprint

The EP4CE75F29C9L is an Intel Cyclone® IV E FPGA with 75408 logic elements and 426 user I/O, packaged in a 780-ball FBGA (29x29 mm). The 2.8 Mbit embedded RAM (2810880 total RAM bits) and 4713 LABs/CLBs provide enough fabric for a soft-core processor, a modest DSP pipeline, and peripheral glue logic on a single die — no external CPLD needed for the I/O expansion.

Core voltage and temperature grade

The core supply is 0.97 V to 1.03 V — a tight 60 mV window that demands a low-noise regulator within 1% set-point accuracy. Surface-mount assembly on the 780-FBGA (29x29 mm) requires a controlled reflow profile per the JEDEC MSL rating — the package is sensitive to moisture absorption, so a bake cycle is mandatory if the seal time on the tray has been exceeded.

Active lifecycle and sourcing posture

Sourced through independent distribution channels, the part is quoted against the BOM quantity at RFQ. The base product number EP4CE75 covers multiple speed and temperature grades; confirm the full suffix (F29C9L) matches the programmed speed bin and package variant before committing the line.

Frequently asked questions

What is the closest pin-compatible alternative to EP4CE75F29C9L in the Cyclone IV E family?

Within the same 780-BGA footprint, the EP4CE55F29C9L offers 55856 logic elements and 374 I/O — a step down in density and I/O count. The EP4CE115F29C9L provides 114480 logic elements and 528 I/O for a higher-density option. All share the same 29x29 mm package and 0.97–1.03 V core supply, so a board spin is not required for a density swap within the family.

What compliance documentation does Intel provide for EP4CE75F29C9L?

Intel provides RoHS and REACH compliance declarations for the Cyclone IV E series. The 780-FBGA package is lead-free and halogen-free per the standard Intel green packaging specification. UL and IEC certification data is available in the device qualification report on Intel's site.