Logic density and I/O budget for mid-range designs
The EP4CE75F29C8LN packs 75,408 logic elements across 4,713 LABs/CLBs, placing it in the upper-mid density tier of the Cyclone IV E family. That logic count handles moderate DSP pipelines, soft-core processors, or parallel interface controllers without forcing a move to the next package size. With 426 user I/O in a 780-BGA, the pinout supports wide memory buses (DDR2/DDR3 controllers), parallel ADC/DAC interfaces, or a dense set of peripheral links. The 29x29 mm FBGA footprint keeps board routing manageable on a standard 6- or 8-layer PCB.
On-chip memory and supply rail planning
Total RAM is 2,810,880 bits, distributed as M9K blocks — enough for moderate FIFOs, line buffers, or coefficient storage. For designs needing external memory, the I/O count leaves room for a parallel DDR interface alongside other peripherals. Core voltage is tight: 0.97 V to 1.03 V. The 60 mV window means the regulator must be accurate — a 1% rail at 1.0 V sits inside the range, but a 3% rail may drift out under load. Plan for a dedicated LDO or a POL converter with remote sense. Operating temperature is 0°C to 85°C junction — commercial grade. This suits telecom racks, industrial controllers, and lab instrumentation. No extended or automotive temp rating; if the ambient hits 70°C with a dense design, budget airflow or a heatsink.
Active lifecycle and sourcing posture
That means the BOM line is stable for ongoing production and new designs alike. Sourced through independent distribution channels.