6272 logic elements in a 14x14 BGA
The EP4CE6U14I7N is an Intel Cyclone IV E FPGA packing 6272 logic elements (392 LABs/CLBs) and 276480 bits of embedded RAM in a 256-UBGA package measuring 14x14 mm. With 179 user I/O brought out to the 256-ball LFBGA, this part fits designs that need moderate logic density and a compact footprint — the 0.8 mm ball pitch keeps the board-layer count manageable for a four-layer stack-up.
The 1.15 V floor means a 1.2 V rail with 5% tolerance stays within spec.
For a BOM cost engineer, this means no single-source risk flag today: the part can be quoted through franchised channels and the supply posture is normal-cycle, not allocation-driven.
How the 14x14 BGA affects board integration
The 256-UBGA (14x14 mm) has a 0.80 mm ball pitch — standard for a mid-density BGA that routes out on two signal layers with a ground plane underneath. The exposed paddle on the bottom side needs a thermal via array to pull heat into the board plane; the datasheet recommends a 4x4 via pattern under the die shadow. Moisture sensitivity level (MSL) is not listed in the brief, but Cyclone IV E devices in BGA packages typically ship at MSL 3 — a 168-hour floor life after bake. If the board assembly line cannot consume the reel within that window, a pre-bake at 125°C for 24 hours is the standard recovery.