6272 logic elements in a 256-LBGA
The EP4CE6F17C8L: With 179 user I/O and 276480 total RAM bits, this device fits logic-intensive glue logic, sensor fusion, or display interface designs that need moderate fabric density and plenty of pins for parallel buses.
RAM budget and logic utilization
The 276480 RAM bits (270 Kbit) support small FIFOs, look-up tables, or coefficient storage without external SRAM — count the block RAM usage against the fabric LUTs before routing, because a design that fills 90% of the LEs and 80% of the RAM may still close timing if the floorplan is clean. The 392 LABs/CLBs each contain 16 logic elements, so the effective LUT count is 6272 — budget realistically for state machines and pipeline stages; the published 6272 cells are the raw count, not the routable equivalent after clock and control signal distribution.
Supply voltage and temperature grade
Core supply range is 0.97 V to 1.03 V — a tight 60 mV window that demands a regulated rail with less than 3% ripple; a standard 1.0 V LDO with 1% accuracy covers it, but a switching converter needs output capacitance sized for the transient load step.
Package and board integration
The 256-LBGA (17x17 mm) with 179 routed I/O leaves 77 balls as power/ground — the pin map dictates a 4-layer board minimum for fan-out; the 0.80 mm ball pitch allows via-in-pad with microvias on a standard HDI stackup. Supplied in tray packaging — the tray orientation and anti-static handling matter for pick-and-place feeders; the JEDEC tray footprint is standard for 256-ball BGA reels.