Logic density and I/O for a 6K-LE FPGA
The EP4CE6F17A7N packs 6272 logic elements across 392 LABs/CLBs — enough for a modest soft-core processor, a few UART/SPI controllers, and glue logic without filling the device. The 179 user I/O in a 256-FBGA give you headroom for a parallel bus, external SRAM interface, and a dozen sensor inputs before you hit the pin limit. On-chip memory totals 276480 bits, which handles a 128×32 FIFO or a small frame buffer for video line processing without external SRAM. The 1.15V to 1.25V core supply means you need a dedicated regulator rail, not a shared 3.3V or 1.8V bus.
Industrial temperature grade and package
The 256-FBGA (17×17 mm) footprint is a standard BGA with 1.0 mm ball pitch — four-layer board with via-in-pad is recommended for the inner rows, but a well-designed two-layer can work if you route the core supply on the bottom. The package is tray delivery — no tape-and-reel, so factor in pick-and-place handling for the tray format.
Active lifecycle and sourcing posture
No pin-compatible second-source from another vendor exists; the Cyclone IV E family is Intel-only.