Intel Cyclone IV E FPGA, EP4CE55F29C8N, 55856 logic elements, 374 I/O, 2396160 total RAM bits, 1.15V~1.25V supply, 0°C~85°C, 780-FBGA (29x29) package, Tray.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting type | Surface Mount |
| Voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 374 |
| Case | 780-BGA |
| Total RAM bits | 2396160 |
| Number of LABs (CLBs) | 3491 |
| Number of logic elements (Cells) | 55856 |
374 I/O in a 780-ball BGA. The 29x29 mm footprint is manageable on a four-layer board. The commercial temperature range (0°C to 85°C junction) is fine for lab equipment, office networking, or indoor industrial control.
The product status is Active.
No direct pin-compatible second source is documented. Within the Cyclone IV E family, the EP4CE40F29C8 (39,600 LEs, same 780-BGA package) is a lower-density alternative; the EP4CE75F29C8 (75,408 LEs) is a higher-density drop-in if the BOM can absorb the cost increase.
The C8N is rated for 0°C to 85°C junction temperature (commercial); the I8N is rated for -40°C to 100°C (industrial). All other specs — logic elements, I/O count, RAM, package — are identical.
It sits in the middle of the Cyclone IV E density range. The EP4CE40F29C8 has 39,600 LEs and 1,161,216 RAM bits; the EP4CE55 doubles the RAM to 2,396,160 bits and adds about 16,000 LEs. The EP4CE6F17C8N is a much smaller part (6,272 LEs, 276,480 RAM bits) in a 256-ball BGA.