Skip to main content
Intel EP4CE55F29C6 — FPGA / CPLD & Programmable Logic

EP4CE55F29C6 Intel Cyclone IV E FPGA, 55856 LEs, 374 I/O

MPNEP4CE55F29C6
Active

Intel Cyclone® IV E FPGA, EP4CE55F29C6, 55856 logic elements, 374 I/O, 2396160 RAM bits, 780-BGA, commercial temp.

$69.0000Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE55F29C6 specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Voltage1.15V ~ 1.25V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)374
Case780-BGA
Total RAM bits2396160
Number of LABs (CLBs)3491
Number of logic elements (Cells)55856

Product details

Logic fabric and memory — count the LUTs honestly

The EP4CE55F29C6: With 55,856 logic elements arranged into 3,491 LABs/CLBs, this Cyclone IV E device sits in the upper-mid range of the family — enough fabric for a soft-core processor, a video scaler, or a multi-channel serial bridge without pushing past 85% utilization. The 2,396,160 total RAM bits (roughly 2.3 Mbit) are distributed as M9K blocks, each 9 Kbit wide, giving 260 blocks for dual-port or FIFO use. At 374 user I/O in a 780-ball BGA, the pinout is dense enough to route a wide parallel bus alongside LVDS pairs.

Package and board-fit — 780-BGA footprint

The 780-FBGA (29×29 mm) body with 1.0 mm ball pitch is a standard four- or six-layer PCB target — no microvia or HDI required for fan-out. The supplier device package is 780-FBGA (29x29).

The junction range is the same as the operating range; no separate storage limit is listed, but standard JEDEC J-STD-020 moisture sensitivity applies to the BGA package.

Sourcing posture — quoted per RFQ

The EP4CE55F29C6 is sourced through authorized and independent distribution channels.

Frequently asked questions

Where can I buy EP4CE55F29C6?

The EP4CE55F29C6 is available to order through our distribution desk.

What is the equivalent or replacement for EP4CE55F29C6?

The Cyclone IV E family includes higher-density parts (e.g., EP4CE75, EP4CE115) but those differ in logic element count, RAM, and I/O — a board spin would be required for a density upgrade.