Logic fabric and I/O headroom
The EP4CE40F29I7N packs 39,600 logic elements (LEs) in a Cyclone IV E fabric — enough for a soft-core processor, a DSP pipeline, and several peripheral controllers without squeezing the fit. The 532 user I/O break out to a 780-ball FBGA, so the pinout density demands a multi-layer board with via-in-pad or microvia fan-out for the inner rows. On-chip memory totals 1,161,216 bits of embedded RAM, organised as M9K blocks. That is roughly 142 KB of block RAM — enough to buffer a VGA frame line or hold a moderate-size packet FIFO without going off-chip.
The 780-FBGA measures 29 mm × 29 mm — the BGA footprint requires a soldermask-defined pad and at least four layers for signal breakout.
Sourced through independent distribution channels.
