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Intel EP4CE40F29C7N — FPGA / CPLD & Programmable Logic

Altera EP4CE40F29C7N Cyclone IV E FPGA, 39600 LEs, 532 I/O

MPNEP4CE40F29C7N
Active

Intel/Altera Cyclone IV E FPGA, EP4CE40F29C7N, 39600 logic elements, 532 I/O, 1161216 total RAM bits, 2475 LABs/CLBs, 780-BGA, 0°C to 85°C, 1.15V–1.25V supply.

$1.7100Ref. price · indicative, final on quote
Intel EP4CE40F29C7N datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE40F29C7N specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Supply voltage1.15V ~ 1.25V
Operating temperature0°C~85°C(TJ)
PackageTray
Number of i (O)532
Case780-BGA
Total RAM bits1161216
Number of LABs (CLBs)2475
Number of logic elements (Cells)39600

Product details

Active lifecycle — no LTB risk for production builds

The EP4CE40F29C7N is listed as Active. There is no last-time-buy window or obsolescence notice on this part.

Sourcing and supply posture

The active status means no allocation scramble expected, but the 780-BGA package may have longer lead times than more common QFP packages — plan the procurement gate accordingly. No official second-source cross-reference is listed in the evidence, so dual-sourcing would require qualifying a functionally equivalent FPGA from another vendor.

Frequently asked questions

Where can I buy EP4CE40F29C7N and how is it quoted?

This part is sourced through independent distribution and quoted to order against an RFQ. Availability and current pricing are confirmed at the time of quote — submit an RFQ for your target volume.

What is the difference between EP4CE40F29C7N and EP4CE40F23C7N?

Both share the same Cyclone IV E core (39600 LEs, 1161216 RAM bits) but differ in package and I/O count. The EP4CE40F29C7N uses a 780-BGA with 532 I/O, while the EP4CE40F23C7N uses a 484-BGA with fewer I/O. They are not pin-compatible — the board layout must match the package.

Can EP4CE40F29C7N be used as a direct replacement for EP4CE40F23C7N?

No — they have different packages (780-BGA vs 484-BGA) and different I/O counts (532 vs fewer). The PCB must be designed for the specific package footprint.