39600 logic elements in a 23x23 mm BGA
The EP4CE40F23A7N: With 328 user I/O and 1161216 bits of embedded RAM, the part handles parallel bus interfaces and moderate FIFO depths without external SRAM. The 1.15V to 1.25V core supply keeps dynamic power under 1.5W typical at 200 MHz — relevant for fan-less enclosures or conduction-cooled assemblies.
Industrial temperature grade and package constraints
The 484-FBGA demands a controlled-solder-profile reflow and a 4+ layer PCB for the BGA fan-out — the 0.8 mm ball pitch is routable on standard line/space but the inner rows need via-in-pad or microvias for full escape. The tray packaging means the parts arrive in anti-static trays, not tape-and-reel — plan for pick-and-place with a tray feeder or manual loading. Surface-mount only; no through-hole equivalent exists in this package family.
Active lifecycle and sourcing posture
The part carries Intel's standard warranty when sourced from an authorized channel.
Peer comparison: wider I/O or newer process
The EP4CE40F29C8 is the same Cyclone IV E die in a 484-BGA with 532 I/O — 204 more than the F23 variant — but its temperature range tops out at 85°C, not 125°C. If your design needs the extra I/O and lives in a controlled environment, that is the pin-compatible swap. If you need the industrial temp and can live with 328 I/O, the F23A7N is the correct choice.