It sits in the middle of the Cyclone IV E density range — enough logic for a modest communications bridge, a multi-axis motor-control state machine, or a video scaler front-end, but not the largest device in the series. The 780-ball BGA (29×29 mm body) routes out all those I/O, which means the PCB needs at least six layers to escape the balls cleanly.
Intel Cyclone IV E EP4CE30F29C8 FPGA, 28K LE, 532 I/O, 780-BGA
MPNEP4CE30F29C8
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Intel Cyclone IV E series FPGA, EP4CE30F29C8, 28,848 logic elements, 532 I/O, 608256 total RAM bits, 780-BGA package, 1.15V–1.25V core supply, 0°C to 85°C commercial temperature.
$69.0000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C~85°C(TJ) |
| Package | Tray |
| Number of i (O) | 532 |
| Case | 780-BGA |
| Total RAM bits | 608256 |
| Number of LABs (CLBs) | 1803 |
| Number of logic elements (Cells) | 28848 |
Product details
Frequently asked questions
Can EP4CE30F29C8 replace EP4CE30F29C7?
The EP4CE30F29C8 and EP4CE30F29C7 share the same base product number EP4CE30, same logic element count, same I/O count, and same 780-BGA package. The suffix difference indicates a speed grade variant — the C8 is the standard speed grade, while the C7 is a faster speed grade. They are pin-compatible and functionally identical in logic capacity; the C8 will run at a lower maximum clock frequency than the C7. For a drop-in replacement, verify timing closure at your target frequency with the C8 timing model.
What are the equivalent or alternative parts to EP4CE30F29C8?
Within the Cyclone IV E family, the EP4CE75F23C7N is a larger device with 75,408 logic elements and 292 I/O in a 484-ball BGA — more logic but fewer I/O and a different footprint. The EP4CE6F17C8N is a smaller device with 6,272 logic elements and 179 I/O in a 256-ball BGA. Neither is a direct pin-compatible replacement; a board redesign is required for either alternative.
What is the package size and pin count of EP4CE30F29C8?
The EP4CE30F29C8 comes in a 780-ball BGA package with a 29×29 mm body (780-FBGA). Ball pitch is 1.0 mm.