Device identity and key parametrics
The EP4CE30F23C9LN: On-chip memory totals 608256 RAM bits, distributed across M9K blocks, which is enough for moderate FIFO or small frame buffers without external SRAM. The core supply operates from 0.97 V to 1.03 V — a tight 60 mV window — so the power rail needs a regulator with ±1.5% set-point accuracy or better to stay inside the absolute-maximum ratings.
Housed in a 484-ball FBGA (23x23 mm), the EP4CE30F23C9LN requires a standard BGA reflow profile with a peak temperature around 245°C for lead-free solder. The mounting type is surface mount only — no socketed or press-fit option exists for this package.
It is not qualified for extended industrial (-40°C) or automotive environments.
