Intel Cyclone® IV E FPGA, EP4CE30F23C6, 28848 logic elements, 1803 LABs/CLBs, 608256 total RAM bits, 328 user I/O, 484-BGA (23x23 mm), 1.15V–1.25V core supply, 0°C–85°C operating temperature.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting | Surface Mount |
| Supply voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C~85°C(TJ) |
| Package | Tray |
| Number of i (O) | 328 |
| Case | 484-BGA |
| Total RAM bits | 608256 |
| Number of LABs (CLBs) | 1803 |
| Number of logic elements (Cells) | 28848 |
That locks it into indoor, climate-controlled equipment — office peripherals, test gear, telecom racks with active cooling. No industrial motor drives or under-hood automotive here; for those you'd look at the -I7 or -I8 industrial-temp variants (same die, different screening).
484-ball BGA, 23×23 mm body. The 328 I/O are distributed across the ball field. The tray package means it ships in anti-static trays.
28,848 logic elements, 1,803 LABs/CLBs, 608,256 total RAM bits, 328 user I/O, 484-BGA package (23x23 mm), 1.15 V to 1.25 V core supply, commercial temperature range 0°C to 85°C junction.
Intel does not list a direct pin-compatible replacement for the EP4CE30F23C6. Within the Cyclone IV E family, the EP4CE75F23C7N uses the same 484-BGA package but has 75,408 LEs and 292 I/O — a board respin is needed for the I/O count difference. For new designs, Intel recommends evaluating the Cyclone 10 LP family.