Intel Cyclone® IV E FPGA, EP4CE22E22I8L, 22,320 logic elements, 79 I/O, 608,256 total RAM bits, 144-LQFP Exposed Pad, -40°C to 100°C.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting type | Surface Mount |
| Voltage | 0.97V ~ 1.03V |
| Operating temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Number of i (O) | 79 |
| Case | 144-LQFP Exposed Pad |
| Total RAM bits | 608256 |
| Number of LABs (CLBs) | 1395 |
| Number of logic elements (Cells) | 22320 |
Rated for -40°C to 100°C junction temperature, the EP4CE22E22I8L covers industrial thermal profiles.
The 144-EQFP (20x20 mm) with exposed pad gives 79 available I/O.
There is no pin-compatible second source. The closest functional peer in logic density and RAM is the Intel 10CL025ZE144I8G (Cyclone 10 LP, 24,624 LEs, same 608 Kbit RAM, same 144-EQFP package), but the architecture and toolchain differ – a design migration would require recompilation.
The pinout is defined by the 144-EQFP package assignment for the Cyclone IV E family. Intel provides pin connection guidelines and a pin-out file in the device documentation. The 79 user I/O are distributed across the four sides of the package; the exposed pad is connected to GND and must be soldered to a thermal land on the PCB.