Intel Cyclone® IV E FPGA, EP4CE22E22C7N, 22320 logic elements, 79 I/O, 608256 total RAM bits, 144-EQFP (20x20 mm) package, 1.15V–1.25V supply, 0°C to 85°C operating temperature, tray.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting type | Surface Mount |
| Voltage | 1.15V ~ 1.25V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 79 |
| Case | 144-LQFP Exposed Pad |
| Total RAM bits | 608256 |
| Number of LABs (CLBs) | 1395 |
| Number of logic elements (Cells) | 22320 |
The 144-EQFP (20x20 mm) with exposed pad provides 79 I/O. The exposed pad must be soldered to a ground-plane land on the PCB.
The EP4CE22E22C7N has an active lifecycle status. Intel continues to manufacture the Cyclone IV E family. For volume commitments, we quote against an RFQ.
Within the Cyclone IV E family, the EP4CE22E22C7N has no direct pin-compatible replacement – the EP4CE40F29C8 (39600 LEs) and EP4CE6F17C8N (6272 LEs) use different packages and I/O counts. The EP4CE22E22C8N is the same die with a different speed grade (C8 vs C7) in the same 144-EQFP package, so it is a drop-in swap if the timing closure allows one speed bin lower. No second-source FPGA from another manufacturer is pin-compatible.
The only difference is the speed grade: C7 is the faster bin, C8 is one step slower. Both use the same die, the same 144-EQFP package, the same 79 I/O, and the same 22320 logic elements. If your timing analysis closes on the C8 grade, you can use it as a cost-reduction drop-in. If your design requires the C7 timing margin, the C8 will not meet setup/hold without a redesign.