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Intel EP4CE15F17A7N — FPGA / CPLD & Programmable Logic

Intel EP4CE15F17A7N Cyclone IV E FPGA, 15408 LEs, 165 I/O

MPNEP4CE15F17A7N
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Intel Cyclone IV E FPGA, EP4CE15F17A7N, 15408 logic elements, 165 I/O, 516096 total RAM bits, 256-FBGA (17x17), 1.15V~1.25V supply, -40°C~125°C (TJ), Tray.

$1.5400Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE15F17A7N specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Supply voltage1.15V ~ 1.25V
Operating temperature-40°C~125°C(TJ)
PackageTray
Number of i (O)165
Case256-LBGA
Total RAM bits516096
Number of LABs (CLBs)963
Number of logic elements (Cells)15408

Product details

15408 logic elements in a 256-ball BGA

The EP4CE15F17A7N is an Intel Cyclone IV E FPGA with 15408 logic elements distributed across 963 LABs/CLBs. That is 165 user I/O brought out to a 256-ball FBGA package on a 17x17 mm footprint. On-chip block RAM totals 516096 bits — enough for moderate FIFO buffers, line stores, or coefficient tables without external memory for many control-path designs.

The I/O banks run from separate supplies (not listed here, but standard Cyclone IV E bank voltage is 2.5 V, 3.0 V, or 3.3 V depending on the interface).

256-ball FBGA (Fine-pitch Ball Grid Array) on a 17x17 mm body. The 1.0 mm ball pitch is layout-friendly — a 4-layer board with microvias is not strictly required, though a 6-layer stack-up gives cleaner power distribution for the 1.2 V core plane. Surface-mount only. The Tray packaging means the parts ship in anti-static trays, not tape-and-reel — factor this into the pick-and-place feeder setup if you are running high-volume assembly.

Sourced through authorized and independent distribution channels.

Frequently asked questions

What is the pin-compatible alternative to EP4CE15F17A7N in the same family?

Within the Cyclone IV E family, the EP4CE22F17A7N is a direct pin-compatible upgrade with 22320 logic elements in the same 256-FBGA package. The EP4CE15F17A7N and EP4CE22F17A7N share the same footprint and I/O count, so a BOM swap does not require a board spin — only a bitstream rebuild for the larger fabric.

What compliance documentation does Intel provide for EP4CE15F17A7N?

Intel provides RoHS and REACH compliance declarations for the EP4CE15F17A7N. The part is lead-free and halogen-free per the standard Intel green packaging statement. UL and IEC certification data is available in the device qualification report.