Intel Cyclone® IV E FPGA, EP4CE15F17A7N, 15408 logic elements, 165 I/O, 516096 total RAM bits, 256-FBGA (17x17), 1.15V~1.25V supply, -40°C~125°C (TJ), Tray.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting type | Surface Mount |
| Voltage | 1.15V ~ 1.25V |
| Operating temperature | -40°C~125°C(TJ) |
| Package | Tray |
| Number of i (O) | 165 |
| Case | 256-LBGA |
| Total RAM bits | 516096 |
| Number of LABs (CLBs) | 963 |
| Number of logic elements (Cells) | 15408 |
Rated for -40°C to 125°C junction temperature, this is the industrial-plus tier.
This part is listed as Active — no end-of-life notice, no last-time-buy clock ticking.
The 256-FBGA package has 165 usable I/O.
No — this part is listed as Active. Intel has not issued an EOL notice for the Cyclone IV E family. It remains a current-production device suitable for new designs.
The closest functional equivalent within the Cyclone IV E family is the EP4CE10U14I7N, which has 10320 logic elements and 179 I/O in a different package (256-UBGA). For a drop-in density match, the Cyclone 10 LP 10CL016ZU256I8G offers 15408 logic elements and 162 I/O in the same 256-FBGA footprint, but with a 1.0V core supply and a narrower temperature range (-40°C to 100°C).
The pinout is defined in Intel's Cyclone IV E pin connection guidelines (document MNL-01062). The 256-FBGA has 165 user I/O distributed across eight I/O banks, each with its own VCCIO supply. The ball map is standard for the 17x17 mm 1.0 mm pitch package.
The difference is the temperature grade. The EP4CE15F17A7N is rated for -40°C to 125°C (TJ), while the EP4CE15F17C8N is a commercial-temperature variant (0°C to 85°C). The logic density, I/O count, and package are identical.