Intel Cyclone® IV E FPGA, EP4CE15E22I8LN, 15408 logic elements, 516096 total RAM bits, 81 user I/O, 0.97V–1.03V core supply, -40°C to 100°C junction temperature, 144-EQFP (20x20) package, Tray.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting | Surface Mount |
| Supply voltage | 0.97V ~ 1.03V |
| Operating temperature | -40°C~100°C(TJ) |
| Package | Tray |
| Number of i (O) | 81 |
| Case | 144-LQFP Exposed Pad |
| Total RAM bits | 516096 |
| Number of LABs (CLBs) | 963 |
| Number of logic elements (Cells) | 15408 |
With 15408 logic elements and 963 LABs/CLBs, this part fits mid-density designs. The 516096 bits of embedded RAM handle line buffers and FIFOs without external SRAM.
The 100°C TJ limit means the die temperature, not the case.
That means it is safe to qualify into a new BOM today. If you are looking at a legacy design that already uses this part, the supply outlook is stable for the foreseeable future.
The suffix 'N' typically denotes a lead-free / RoHS-compliant finish, while the version without 'N' may use a tin-lead finish. Both are the same Cyclone IV E die with identical logic density and memory; the difference is the solder-ball metallurgy. Verify your assembly process's reflow profile and RoHS requirements before substituting.
There is no direct replacement announced — the part is Active. For a smaller logic budget, the EP4CE10U14I7N (10320 LEs) is pin-compatible in the same 144-EQFP footprint but with fewer I/O and less RAM. For more I/O, the 10CL016ZU256I8G (162 I/O) offers the same 15408 LEs in a larger 256-ball BGA.
Key specs: 15408 logic elements, 963 LABs/CLBs, 516096 total RAM bits, 81 user I/O, core supply 0.97V–1.03V, junction temperature -40°C to 100°C, package 144-EQFP (20x20). It is a Cyclone IV E device in Tray packaging.