Intel Cyclone® IV E FPGA, EP4CE115F23C9LN, 114480 logic elements, 280 I/O, 3981312 bits RAM, 484-FBGA (23x23), 0.97V~1.03V supply, 0°C to 85°C junction temperature, Tray.
| Parameter | Value |
|---|---|
| Series | Cyclone® IV E |
| Mounting type | Surface Mount |
| Voltage | 0.97V ~ 1.03V |
| Operating temperature | 0°C~85°C(TJ) |
| Package | Tray |
| Number of i (O) | 280 |
| Case | 484-BGA |
| Total RAM bits | 3981312 |
| Number of LABs (CLBs) | 7155 |
| Number of logic elements (Cells) | 114480 |
The 114480 logic elements (7155 LABs/CLBs) define the usable gate budget. The 3981312 bits of block RAM provide on-chip storage for FIFOs and coefficient tables.
The EP4CE115F23C9LN carries an Active product status. No last-time-buy notice or end-of-life window is on the horizon.
The 0°C to 85°C junction temperature rating covers commercial and light-industrial environments.
The EP4CE115F23C9LN is a Cyclone IV E FPGA with 114480 logic elements, 7155 LABs/CLBs, 3981312 bits of embedded RAM, 280 user I/O, a 0.97V to 1.03V core supply, and a 0°C to 85°C junction temperature range. It comes in a 484-FBGA (23x23 mm) package on Tray.
The suffix 'N' in EP4CE115F23C9LN typically indicates a lead-free / RoHS-compliant finish. The EP4CE115F23C9L (without 'N') is the tin-lead version. Both share the same 114480 logic elements, 280 I/O, and 484-FBGA package — the difference is the solder-ball metallurgy. Verify your assembly's RoHS and reflow profile requirements before substituting.