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Intel EP4CE115F23C9L — FPGA / CPLD & Programmable Logic

Intel EP4CE115F23C9L Cyclone IV E FPGA, 114480 LEs

MPNEP4CE115F23C9L
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Intel Cyclone® IV E FPGA, EP4CE115F23C9L, 114480 logic elements, 280 I/O, 3981312 total RAM bits, 484-BGA, tray.

$458.1222Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

EP4CE115F23C9L specifications
ParameterValue
SeriesCyclone® IV E
MountingSurface Mount
Voltage0.97V ~ 1.03V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)280
Case484-BGA
Total RAM bits3981312
Number of LABs (CLBs)7155
Number of logic elements (Cells)114480

Product details

Logic density and I/O for a mid-range FPGA design

The EP4CE115F23C9L sits at the high end of the Cyclone IV E family with 114480 logic elements — enough to implement a soft-core processor, a video scaler, or a multi-axis motor controller with room left for glue logic. 280 user I/O in a 484-ball BGA gives you the pin count to interface with a parallel LCD, DDR2 memory, and a dozen sensors without multiplexing the bus.

On-chip memory and core supply for the signal chain

3981312 total RAM bits (about 3.8 Mbit) are distributed as M9K blocks — each block is 9 Kbit true dual-port, so you can build FIFOs, line buffers, or small packet caches without external SRAM. The core voltage rail is tight at 0.97 V to 1.03 V — a 1.0 V switching regulator with ±3% setpoint covers it, but a standard 1.2 V rail will damage the die.

Package and board integration

484-ball FBGA, 23 mm square, 1.0 mm ball pitch — four-layer PCB with via-in-pad is the practical minimum for fan-out; six layers if you route the full 280 I/O to the edge connectors. Surface-mount only; the tray packaging means the parts ship in matrix trays, not tape-and-reel, so pick-and-place feeders need a tray handler or waffle-pack adapter.

Frequently asked questions

How does EP4CE115F23C9L compare to the smaller Cyclone IV E parts like EP4CE40?

The EP4CE115 packs roughly 2.9× the logic elements (114480 vs 39600) and 3.4× the on-chip RAM (3981312 vs 1161216 bits) compared to the EP4CE40, but uses a smaller 484-ball BGA package versus the EP4CE40's 780-ball BGA — so the EP4CE115 has fewer I/O (280 vs 532) despite the higher gate count.