Intel MAX® 10 FPGA, 10M40DDF672C8G, 40000 logic elements, 500 I/O, 1290240 total RAM bits, 672-FBGA (27x27), commercial temp 0°C to 85°C, 2.85V–3.465V supply, surface mount, tray.
| Parameter / Attribute | Specification / Value |
|---|---|
| Series | MAX® 10 |
| Mounting | Surface Mount |
| Supply voltage | 2.85V ~ 3.15V, 3.135V ~ 3.465V |
| Operating temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Number of i (O) | 500 |
| Case | 672-BGA |
| Total RAM bits | 1290240 |
| Number of LABs (CLBs) | 2500 |
| Number of logic elements (Cells) | 40000 |
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Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.
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The 40000 logic-element count places this part in the mid-range of the MAX 10 family. The 500 I/O differentiates it from the 10M40DDF484C8G (360 I/O) and the 10M40DDF256C8G (178 I/O). The 1290240 RAM bits provide block RAM for a modest FIFO or small packet buffer.
That is commercial grade — fine for telecom central offices, data-centre equipment, or benchtop instruments. Not rated for outdoor base stations, engine bays, or unheated enclosures.
It is a MAX 10 FPGA with 40000 logic elements, 500 I/O, 1290240 RAM bits, in a 672-FBGA package, commercial temperature range (0°C to 85°C), and dual supply voltage (2.85V–3.15V core, 3.135V–3.465V I/O).
The part is listed as RoHS compliant per the standard Intel MAX 10 series environmental compliance; the C8G suffix indicates a RoHS-compliant, lead-free finish.
The 10M40DDF672C8G has 500 I/O in a 672-ball BGA, while the 10M40DDF484C8G has 360 I/O in a 484-ball BGA; both share the same 40000 logic elements and 1290240 RAM bits.