Infineon Technologies S25FL256SAGNFI013 — Memory (DRAM / SRAM / Flash / EEPROM)
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RoHS Compliant · Lead-Free EIA-481 Standard
Infineon Technologies / Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S25FL256SAGNFI013 FL-S NOR Flash, 256Mbit, 133MHz

MPN S25FL256SAGNFI013
Active Spot Stock · 24-48h Dispatch 100% Original Sealed

Infineon FL-S series NOR Flash, 256Mbit, SPI Quad I/O, 133MHz, 2.7-3.6V, -40 to 85°C, 8-WSON (6x8), Tape & Reel.

In Stock: 2,500 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$5.31 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$5.31
10+ pcs
$4.78
30+ pcs
$4.35
100+ pcs
$3.93
500+ pcs
$3.66
1,000+ pcs
$3.45
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$5.31 / ea

2,500 in stock — maximum per order · 3–4 days lead time

$4.78 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (13)
Package / Case 8-WDFN Exposed Pad
Supply Voltage 2.7V ~ 3.6V
Speed / Frequency 133 MHz
Memory / RAM 256Mbit

Full Technical Specifications

13 Parameters
S25FL256SAGNFI013 specifications
Parameter / AttributeSpecification / Value
SeriesFL-S
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage2.7V ~ 3.6V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR) Cut Tape (CT)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
Case8-WDFN Exposed Pad
Memory organization32M x 8
Series Sibling Variants

Infineon Technologies FL-S Series Models

Sibling variants, package options, and speed/density grades in this Infineon Technologies semiconductor series. Active Shenzhen warehouse allocation and rapid 24-48h dispatch.

Technical Details & Description

256 Mbit NOR Flash, 133 MHz quad-I/O

The Infineon S25FL256SAGNFI013 is a 256 Mbit SPI NOR Flash from the FL-S series, organised as 32M x 8 bits. It runs the SPI bus at up to 133 MHz in quad-I/O mode, which means the effective read throughput can hit 532 MHz equivalent when all four I/O lines are active — useful for XiP (eXecute-in-Place) where the CPU fetches code directly from flash without shadowing to RAM.

8-WSON package — rework and footprint

Housed in an 8-WDFN with exposed pad, supplier package designation 8-WSON (6x8 mm). The exposed paddle on the underside needs a thermal via array in the PCB to pull heat into the ground plane — without it, the part runs hotter under sustained read bursts. The pad also serves as the ground return for the die, so a solid solder joint under the paddle is critical for both thermal and electrical performance.

RoHS3 compliant. The tape-and-reel packaging suits automated pick-and-place assembly in volume.

Peer: extended-temperature variant

The closest sibling is the S25FL256SDSMFV013, which shares the same 256 Mbit density, SPI quad-I/O interface, and 2.7 V supply range, but its clock frequency is limited to 80 MHz and its operating temperature extends to 105°C. The S25FL256SAGNFI013 runs 133 MHz but tops out at 85°C — choose the 105°C variant if the board sits in an engine bay or near a heat source; otherwise the 133 MHz part gives faster code execution.

Frequently asked questions

How can I order the S25FL256SAGNFI013 or check availability?

This part is active and sourced through independent distribution.

What is the closest functional second-source for the S25FL256SAGNFI013?

The S25FL256SDSMFV013 is the nearest peer — same 256 Mbit density, same SPI quad-I/O interface, same 2.7 V supply range. The trade-off is 80 MHz clock vs 133 MHz, and 105°C vs 85°C operating temperature. It will not drop in as a direct pin-for-pin swap without verifying the package and pad layout.

S25FL256SAGNFI013
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