Package and mounting for thermal management
Housed in a 24-PowerUFQFN with an exposed pad (3x3 mm), the MAX77751FEFG+ relies on the PCB copper pour and via stitching under the package to dissipate heat from the 3.15A charge pass element.
The device is ROHS3 compliant, meeting the material restriction directive for solder joints and lead-free assembly.
