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AMD XC7A35T-2CPG236C — FPGA / CPLD & Programmable Logic

AMD XC7A35T-2CPG236C Artix-7 FPGA, 33K logic cells, 106 I/O

MPNXC7A35T-2CPG236C
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AMD Artix-7 FPGA, XC7A35T-2CPG236C, 33,280 logic cells, 106 I/O, 1,843,200 total RAM bits, 238-CSBGA (10x10), tray.

$59.7100Ref. price · indicative, final on quote
Packaging238-LFBGA, CSPBGA
RoHSROHS3 Compliant
SeriesArtix-7
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

XC7A35T-2CPG236C specifications
ParameterValue
SeriesArtix-7
MountingSurface Mount
Supply voltage0.95V ~ 1.05V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)106
Case238-LFBGA, CSPBGA
Total RAM bits1843200
Number of LABs (CLBs)2600
Number of logic elements (Cells)33280

Product details

Logic fabric and I/O budget for a 33K-cell design

The XC7A35T-2CPG236C is an AMD Artix-7 FPGA with 33,280 logic cells organized into 2,600 CLB slices — enough fabric for a mid-density glue-logic or DSP-intensive design that needs roughly 26,000 LUTs and leaves margin for a few iterations before the floorplan tightens. Its 106 user I/O, packed into a 238-ball CSBGA on a 10x10 mm substrate, serve designs where the peripheral count is constrained by the package footprint rather than the core logic — think sensor fusion, camera interface, or a modest parallel bus.

On-chip memory and supply tolerance

1,843,200 total RAM bits (1.8 Mbit) of block RAM give the fabric roughly 180 KB of distributed storage — enough for a few frame buffers at VGA resolution or a modest FIFO chain without reaching for external SRAM. The core supply rail is tight at 0.95 V to 1.05 V — the regulator must hold 1.0 V ±50 mV under load transients, so a standard 1.0 V LDO with 1% accuracy and enough headroom for the dropout is the safe call. Commercial temperature grade (0°C to 85°C junction) suits controlled indoor environments — a fanless enclosure with moderate airflow keeps the junction below the ceiling when the design is clocking 200+ MHz across the fabric.

ROHS3 compliant — the 238-CSBGA package uses lead-free solder balls and halogen-free mold compound, meeting the current EU restriction scope without an exemption.

Frequently asked questions

What package does the XC7A35T-2CPG236C use and how does it mount?

It ships in a 238-ball CSPBGA (10x10 mm) with a 0.8 mm ball pitch, surface-mount only. The small footprint means a 4-layer PCB with a solid ground plane under the BGA is the practical minimum for fan-out and decoupling.

What is the logic capacity of the XC7A35T-2CPG236C?

33,280 logic cells (LUT/flip-flop pairs) arranged in 2,600 CLB slices, plus 1,843,200 bits of block RAM. This fabric density handles designs up to roughly 26,000 LUTs with room for routing margin.