Logic capacity and I/O budget for mid-density designs
The XC6SLX16-N3CSG324I packs 14,579 logic cells arranged in 1,139 CLB slices — enough for a soft-core processor plus several peripheral controllers or a modest DSP pipeline without resorting to external logic. 232 user I/O, all routable through the 324-ball CSPBGA grid, give the board designer headroom for a wide parallel bus (e.g., 16-bit DDR or 32-bit SRAM) alongside serial interfaces and general-purpose GPIO. On-chip block RAM totals 589,824 bits — enough for a 64 KB frame buffer or a pair of 32 KB ping-pong FIFOs without external SRAM.
Temperature grade and supply rails
Core voltage is a tight 1.14 V to 1.26 V window — a 1.2 V ± 5 % rail is typical; the PCB power distribution must keep the DC drop under 30 mV from regulator to the BGA balls to stay within spec at full toggle rate.
Housed in a 324-ball CSPBGA (15 mm × 15 mm), the 0.80 mm ball pitch is standard for four-layer PCB fan-out — inner layers carry the core and I/O banks while the outer layers route the 232 signals. Surface-mount only; the package ships in trays, not tape-and-reel, so pick-and-place requires a tray feeder or a manual loading step for high-volume lines.
Lifecycle and sourcing posture
ROHS3 compliant per the manufacturer — the bill of materials excludes the four restricted phthalates and halogenated flame retardants, so it passes EU RoHS and similar regional requirements without a waiver.