Toshiba Semiconductor SSM6K809R,LXHF — Discrete Semiconductors
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Toshiba Semiconductor / Discrete Semiconductors

Toshiba SSM6K809R,LXHF N-Channel MOSFET, 60V 6A, AEC-Q101

MPN SSM6K809R,LXHF
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Toshiba Semiconductor SSM6K809R,LXHF N-Channel MOSFET, Automotive Grade, AEC-Q101, 60 V Vdss, 6 A Id, 36 mOhm Rds(on), 6-TSOP-F Package, Tape & Reel.

In Stock: 17 pcs
MOQ: 1 pcs
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[SPEC] Essential Parameters Snapshot Full Specifications (17)
Package / Case 6-SMD, Flat Leads
Output / Current 60 V

Full Technical Specifications

17 Parameters
SSM6K809R,LXHF specifications
Parameter / AttributeSpecification / Value
FET typeN-Channel
MountingSurface Mount
Drain to source voltage60 V
Drive voltage (Max rds on, min rds on)4V, 10V
Current - continuous drain (Id) @ 25°C6A (Ta)
Power dissipation1.5W (Ta)
Operating temperature175°C
GradeAutomotive
PackageTape & Reel (TR); Cut Tape (CT)
Vgs±20V
TechnologyMOSFET (Metal Oxide)
QualificationAEC-Q101
Case6-SMD, Flat Leads
Vgs(th) (Max) @ id2.5V @ 100µA
Rds on (Max) @ id, vgs36mOhm @ 5A, 10V
Gate charge (Qg) (Max) @ vgs9.3 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds550 pF @ 10 V
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Technical Details & Description

60 V, 6 A N-channel in a 6-TSOP-F — what it means for the BOM

The SSM6K809R,LXHF is an automotive-grade N-channel MOSFET from Toshiba, built on the U-MOSVIII-H trench process.

Rds(on) and gate charge — the switching trade-off

That is the conduction loss floor: at 5 A the dissipation is 0.9 W, well within the 1.5 W package limit at 25°C ambient. The drive voltage range (4 V minimum for rated Rds(on), 10 V for the full enhancement) means a standard 12 V automotive gate driver rail saturates the FET cleanly. Gate charge is 9.3 nC at 10 V — a modest number that keeps the switching transition fast. For a 100 kHz PWM solenoid drive, the gate-drive power is roughly Qg × Vgs × fsw = 9.3 nC × 10 V × 100 kHz = 9.3 mW, negligible in the thermal budget. The 550 pF input capacitance at 10 V drain-source confirms the gate is easy to drive with a standard totem-pole stage.

Package and footprint — 6-TSOP-F surface mount

The 6-TSOP-F package (6-SMD with flat leads) is a small-outline, low-profile body with a 0.95 mm pitch. The flat leads reduce the solder-joint stress compared to a gull-wing, and the exposed pad at the bottom of the package pulls heat into the PCB copper. A 1-square-inch copper pad on the top layer drops the junction-to-ambient thermal resistance below 80°C/W, letting the part run at 1.5 W without a heatsink.

Sourcing and lifecycle — active, no second-source on record

Sourced through independent distribution against an RFQ. No stock-holding claim — this is a quoted-to-order line.

Frequently asked questions

Is SSM6K809R,LXHF AEC-Q101 qualified?

Yes, the SSM6K809R,LXHF carries AEC-Q101 qualification, the automotive-grade discrete semiconductor standard. This certifies it for use in under-hood and cabin electronics where temperature extremes, vibration, and reliability screening are required.

What is the closest functional second-source for SSM6K809R,LXHF?

However, the SSM3K341TU,LF comes in a 3-pin SOT-323 package with 1.8 W dissipation, not the 6-TSOP-F. The pinout and footprint differ, so a direct drop-in is not possible without a board layout change.

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