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Texas Instruments SN75LVDS83CZQLR — Interface & Transceivers

SN75LVDS83CZQLR LVDS Driver, FlatLink, 56-BGA, Obsolete

MPNSN75LVDS83CZQLR
Obsolete

Texas Instruments SN75LVDS83CZQLR, FlatLink™ LVDS Driver, 5 drivers, 0 receivers, 2.8V-3.6V supply, -10°C~70°C, 56-VFBGA Microstar Junior (7x4.5) package.

$6.8100Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

SN75LVDS83CZQLR specifications
ParameterValue
TypeDriver
SeriesFlatLink™
MountingSurface Mount
Supply voltage2.8V ~ 3.6V
ProtocolLVDS
Operating temperature-10°C~70°C
PackageTape & Reel (TR); Cut Tape (CT)
Case56-VFBGA
Number of drivers (Receivers)5/0

Product details

The Texas Instruments SN75LVDS83CZQLR is a 5-channel LVDS driver from the FlatLink™ series, designed to serialize parallel data onto a low-voltage differential signaling bus. It is a driver-only device (5 drivers, 0 receivers) operating from a 2.8V to 3.6V supply rail. The part targets display interfaces and high-speed data links where a narrow, low-swing differential pair replaces a wide parallel bus to reduce cable count and EMI. Typical applications include flat-panel displays, notebook video links, and camera modules that need to push pixel data across a flex or twisted-pair cable. The commercial temperature grade of -10°C to 70°C limits it to indoor, non-condensing environments — not for automotive or industrial outdoor use.

This part carries an official product status of Obsolete. For an existing BOM line that calls out the SN75LVDS83CZQLR, the only sourcing path is the independent distribution channel — surplus, new-old-stock, or broker inventory. There is no official TI successor order code listed in the lifecycle record. When a replacement is needed, the designer must evaluate a pin-compatible or functionally equivalent LVDS driver from TI's current FlatLink or other LVDS portfolio, but no specific alternate is named in this part's record.

The SN75LVDS83CZQLR is supplied in a 56-VFBGA Microstar Junior package (7x4.5 mm body). This fine-pitch BGA demands careful PCB layout: a multi-layer board with microvias or buried vias is typical for fanout. The surface-mount package is MSL-rated per the bag label, but no specific MSL level is stated in this record — treat as MSL 3 or higher unless confirmed. The supply range of 2.8V to 3.6V requires a clean, regulated rail; a local 100 nF ceramic per supply pin and a bulk 1 µF near the BGA corner pads is the usual decoupling prescription. The narrow voltage window means this part does not tolerate a 5V I/O environment without level translation.

Frequently asked questions

What is the replacement for SN75LVDS83CZQLR?

No official TI successor order code is provided in this part's lifecycle record. A designer should evaluate a current-production FlatLink or equivalent LVDS driver from TI for a pin-compatible or functionally equivalent drop-in, but no specific alternate is named here.