Texas Instruments DRA829JMTGBALFR heterogeneous SoC, ARM Cortex-A72, Cortex-R5F, C66x, C7x DSP, 2 GHz/1 GHz/1.35 GHz/1 GHz, 226 I/O, I²C/I³C/MCAN/MMC/SD/SDIO/SPI/UART/USB, -40°C to 105°C junction, Tape & Reel.
| Parameter | Value |
|---|---|
| Operating temperature high | -40°C to 105°C (TJ) |
| Cpu_core | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x |
| Fuse_speed | 2 GHz, 1 GHz, 1.35 GHz, 1 GHz |
| Architecture | DSP, MCU, MPU |
| Connectivity | I²C, I³C, MCAN, MMC/SD/SDIO, SPI, UART, USB |
| Package_type | Tape & Reel (TR) Cut Tape (CT) |
| Number of i (O) | 226 |
| Status | Active |
| Peripheral_types | DMA, PWM, WDT |
The Texas Instruments DRA829JMTGBALFR is a Jacinto 7 family SoC with a dual-core ARM Cortex-A72 cluster at 2 GHz, a quad-core ARM Cortex-R5F at 1 GHz, C66x DSP cores at 1.35 GHz, and a C7x DSP at 1 GHz.
The I³C interface is a key differentiator — it supports higher data rates and in-band interrupts compared to legacy I²C, reducing wiring and latency when connecting multiple environmental or imaging sensors.
Yes, the connectivity list includes I³C alongside I²C, MCAN, MMC/SD/SDIO, SPI, UART, and USB.
The suffix 'R' in DRA829JMTGBALFR indicates Tape & Reel packaging (Cut Tape also available). The base device DRA829JMTGBALF is the same silicon in a different shipping medium — tray or tube. Pin-compatibility is identical; the only difference is the reel format for automated assembly lines.