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Texas Instruments ADS1015IRUGR — Analog & Data Acquisition

ADS1015IRUGR 12-bit sigma-delta ADC, I2C, PGA, X2QFN

MPNADS1015IRUGR
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Texas Instruments ADS1015IRUGR, 12-bit Sigma-Delta ADC, I2C, MUX-PGA-ADC, 2/4 Input Differential/Single-Ended, 3.3k SPS, Internal Reference, X2QFN-10.

$3.0900Ref. price · indicative, final on quote
Packaging10-XFQFN
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ADS1015IRUGR specifications
ParameterValue
Input typeDifferential, Single Ended
MountingSurface Mount
Reference typeInternal
Voltage - supply, analog2V ~ 5.5V
Voltage - supply, digital2V ~ 5.5V
I/O channels2, 4
InterfaceI²C
Operating temperature-40°C~125°C
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesPGA, Selectable Address
ArchitectureSigma-Delta
ConfigurationMUX-PGA-ADC
Number of bits12
Case10-XFQFN
Number of a (D converters)1
Sampling rate (Per second)3.3k

Product details

12-bit sigma-delta with a programmable front end

The Texas Instruments ADS1015IRUGR is a 12-bit sigma-delta ADC that integrates a multiplexer, programmable gain amplifier (PGA), and internal reference into a single X2QFN-10 package. It handles both differential and single-ended inputs across up to four channels, configured through the I²C interface. The PGA allows gain settings up to x16, which means a ±256 mV full-scale range is possible from a 2 V supply — useful for amplifying small sensor signals before conversion without an external op-amp.

Sampling rate and signal bandwidth

Sampling at 3.3 kSPS, this ADC is built for DC and low-frequency signals — thermocouples, strain gauges, pressure transducers, or battery monitoring — not audio or vibration. The sigma-delta architecture provides inherent noise shaping, so the effective resolution at lower data rates exceeds the 12-bit nominal figure. Supply range for both analog and digital sections is 2 V to 5.5 V from a single rail.

Industrial temperature and package fit

The X2QFN-10 package (2.0 mm × 1.5 mm) is a fine-pitch leadless package — board-level inspection requires X-ray for solder-joint verification under the exposed pad.