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Texas Instruments 5962-9089503M2A — Logic ICs

5962-9089503M2A LinCMOS™ CMOS Op-Amp, 1.9 MHz

MPN5962-9089503M2A
End of Life

Texas Instruments LinCMOS™ series, 5962-9089503M2A, CMOS Amplifier, 1 Circuit, 1.9 MHz GBW, 2.8 V/µs Slew Rate, 1.5 mA Supply, 20-CLCC, -55°C to 125°C.

$42.02Ref. price · indicative, final on quote
Packaging20-CLCC
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

5962-9089503M2A Technical Specifications
ParameterValue
SeriesLinCMOS™
Mounting typeSurface Mount
Amplifier typeCMOS
Voltage - input offset0.5 µV
Voltage - supply span1.9 V
Current - supply1.5mA
Current - input bias4 pA
Current - output (Channel)5 mA
Operating temperature-55°C ~ 125°C
Gain bandwidth product1.9 MHz
PackageBulk
Slew rate2.8V/µs
Case20-CLCC
Number of circuits1

Product details

The 5962-9089503M2A: It delivers a gain bandwidth product of 1.9 MHz with a slew rate of 2.8 V/µs, drawing just 1.5 mA of supply current. The supply voltage can run from 1.9 V to 16 V, giving flexibility for single-supply or split-rail designs.

Combined with the 20-CLCC hermetic ceramic package (supplier device package 20-LCCC, 8.89x8.89 mm), this part is designed for sealed, high-reliability environments where plastic packages would risk moisture ingress or thermal cycling failure. Typical deployment scenarios include avionics sensor interfaces, satellite telemetry chains, and downhole drilling instrumentation.

The 0.5 µV input offset voltage allows direct amplification of microvolt-level signals. The 4 pA input bias current does not load high-impedance sources.

Frequently asked questions

Is 5962-9089503M2A RoHS compliant?

No, the part is listed as RoHS non-compliant due to its hermetic ceramic package and leaded solder terminations.