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Renesas Electronics R7FA6M3AF3CLK#AC0 — Discrete Semiconductors

R7FA6M3AF3CLK#AC0 Renesas RA6M3 MCU, 120MHz, 1MB Flash

MPNR7FA6M3AF3CLK#AC0
End of Life

Renesas Electronics RA6M3 series ARM Cortex-M4F MCU, R7FA6M3AF3CLK#AC0, 120MHz, 1MB Flash, 640KB SRAM, 145-TFLGA package, -40 to +105°C.

$13.24Ref. price · indicative, final on quote
Packaging145-TFLGA
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
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Specifications

R7FA6M3AF3CLK#AC0 Technical Specifications
ParameterValue
SeriesRA6M3
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed120MHz
PackageTray
RAM size640K x 8
Core size32-Bit
EEPROM size64K x 8
PeripheralsDMA, LCD, LVD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, SCI, SPI, UART/USART, USB
Number of i (O)110
Core processorARM® Cortex®-M4F
Case145-TFLGA
Data convertersA/D 22x12b SAR; D/A 2x12b
Program memory size1MB (1M x 8)

Product details

RA6M3 MCU for industrial control and HMI

The R7FA6M3AF3CLK#AC0 is a Renesas RA6M3 series microcontroller built around an ARM Cortex-M4F core with a floating-point unit, clocked at 120 MHz. It carries 1 MB of flash program memory and 640 KB of SRAM, giving the firmware team room for a real-time OS, a TCP/IP stack, and a graphics frame buffer without external memory. The 145-TFLGA package (7x7 mm) keeps the PCB footprint compact, and the -40 to +105°C operating range suits it for motor-drive cabinets, outdoor telecom gear, and under-hood automotive modules where the ambient temperature climbs well above 85°C.

Memory and peripheral mix for a single-chip design

The 1 MB flash is organized as 1M x 8 bits, enough for a bootloader, application image, and a small file system. The 640 KB SRAM (640K x 8) supports large data buffers — useful for Ethernet packet handling or a camera frame grab without external SRAM. On-chip EEPROM emulation (64K x 8) stores calibration constants and configuration parameters that survive power cycles without wear-leveling overhead in firmware. The connectivity block includes CANbus, Ethernet, USB, and multiple SCI/SPI/I²C interfaces, so a single MCU can talk to a fieldbus gateway, a local HMI display, and a set of distributed sensors over different serial protocols. Analog front-end: 22-channel 12-bit SAR ADC and two 12-bit DACs. The ADC channel count covers multi-axis current sensing or a bank of thermistor inputs; the DACs can generate analog setpoints for a VFD or a servo drive.

Package and layout considerations

The 145-TFLGA (7x7 mm) package has a 0.5 mm ball pitch. The exposed thermal pad on the underside must be soldered to a PCB copper plane for heat sinking — the datasheet's RthJA figure assumes a 4-layer board with thermal vias under the pad. Without that, junction temperature rises faster under continuous 120 MHz operation. 110 I/O lines are brought out, enough to drive a parallel LCD interface, a memory bus, and a set of discrete I/O without a port expander. The supply range is 2.7 V to 3.6 V, so a single 3.3 V rail powers the core and I/O banks.

Lifecycle and compliance

No official pin-compatible second source is listed. The RA6M3 family shares the same core and peripheral set across package variants, but a drop-in replacement from another vendor does not exist — the BOM line is single-sourced to Renesas.

Frequently asked questions

What is the core speed of the R7FA6M3AF3CLK#AC0?

The ARM Cortex-M4F core runs at 120 MHz. This clock rate, combined with the FPU, gives enough throughput for real-time control loops with floating-point math — motor FOC or sensor fusion — without a separate DSP.

Is the R7FA6M3AF3CLK#AC0 suitable for automotive applications?

The operating temperature range is -40 to +105°C, which covers the cabin and under-hood zones for many automotive modules. However, the part is not listed with an AEC-Q100 grade — confirm with Renesas if PPAP documentation is required for your tier-1 customer.