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Renesas Electronics R5F566TAAGFP#30 — Microcontrollers & Processors (MCU / MPU / DSP)

R5F566TAAGFP#30 Renesas RX MCU, 160MHz, 256KB Flash

MPNR5F566TAAGFP#30
End of Life

Renesas Electronics RX series 32-bit MCU, R5F566TAAGFP#30, RXv3 core, 160 MHz, 256 KB Flash, 64K x 8 RAM, 32K x 8 EEPROM, 100-LQFP, -40 to +105°C.

$6.6Ref. price · indicative, final on quote
Packaging100-LQFP
StockIn Stock (23)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

R5F566TAAGFP#30 Technical Specifications
ParameterValue
SeriesRX
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 5.5V
Operating temperature-40°C ~ 105°C (TA)
Speed160MHz
PackageTray
RAM size64K x 8
Core size32-Bit
EEPROM size32K x 8
PeripheralsDMA, LVD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, I²C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART
Number of i (O)72
Core processorRXv3
Case100-LQFP
Data convertersA/D 22x12b; D/A 2x12b
Program memory size256KB (256K x 8)

Product details

160 MHz RXv3 core with on-chip memory for control firmware

The R5F566TAAGFP#30: That EEPROM block holds calibration coefficients or configuration parameters without wearing the flash — useful for field-updated setpoints in a motor drive or sensor head. The wide supply tolerance also means it survives a 5 V logic bus without level translation on the I/O side.

Industrial temperature grade and peripheral set

The MMC/SD peripheral lets the MCU log data directly to an SD card without an external controller.

Package rework and board-fit considerations

Housed in a 100-LQFP (also supplied as 100-LFQFP, 14x14 mm), the gull-wing leads are visible for inspection and hand-solderable with a fine-tip iron. The 0.5 mm pitch demands a steady hand and a good stencil for paste, but it is far more forgiving than a QFN or BGA under hot air — the leads wick solder and self-align on reflow. Pin 1 is marked by a chamfered corner and a dot on the package body.

Frequently asked questions

What is the closest pin-compatible alternative to R5F566TAAGFP#30 in the RX family?

The RX66T series includes several 100-pin devices with the same RXv3 core and package footprint. The exact flash/RAM/EEPROM split differs by suffix; confirm the memory map against your firmware size before substituting.