Small-package RL78 for tight-space control
The R5F11W68ASM#50 is a 16-bit RL78/G1M microcontroller in a 20-TSSOP package, running at 20 MHz with 8 KB of Flash and 1 KB of RAM. It is built for applications where board space is the constraint — the 4.4 mm-wide TSSOP fits into a sensor housing or a small actuator pod without forcing a multi-layer board. With 16 I/O lines and an 8-channel 8/10-bit ADC, this MCU handles a handful of digital inputs, a few analog sensors, and a UART or CSI link for reporting. It is not a general-purpose workhorse — the peripheral set is lean (POR, WDT, CSI, UART/USART — no I²C, no PWM, no capacitive touch), so the firmware stays simple and the BOM stays small.
Supply and temperature — one rail, industrial range
If the application needs precise timing for a UART baud rate, the internal RC is trimmed to ±1% accuracy across temperature — adequate for 115200 baud but tight for higher rates.
Rework and board-fit — hot-air friendly
The 20-TSSOP (0.173" body width, 0.65 mm pitch) is one of the more forgiving packages under a hot-air station. The leads are visible and accessible — no hidden pads, no thermal pad underneath. A standard TSSOP-20 footprint with a 0.65 mm pitch stencil aperture is all the PCB needs. Pin 1 is marked with a dot on the package top; the orientation is unambiguous even after reflow. The part is ROHS3 compliant, so the solder profile follows standard lead-free reflow (peak 260°C, 30 seconds above 255°C). No special bake-out required unless the moisture sensitivity level (MSL) on the reel label indicates otherwise — typical for this package class is MSL 1 or 2, meaning it survives floor life without a dry pack.
Sourcing and compliance — active, no LTB risk
No stock-holding claim — quoted to order per RFQ.