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NXP Semiconductors MC9S08SH16CTJ — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MC9S08SH16CTJ 8-bit MCU, 40 MHz, 16 KB Flash, 20-TSSOP

MPNMC9S08SH16CTJ
End of Life

NXP S08 8-bit MCU, MC9S08SH16CTJ, 40 MHz, 16 KB Flash, 1K x 8 RAM, 12-ch 10-bit ADC, I²C/SCI/SPI/LINbus, 17 I/O, 2.7V-5.5V, -40°C to 85°C, 20-TSSOP.

$7.11Ref. price · indicative, final on quote
Packaging20-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
SeriesS08
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MC9S08SH16CTJ specifications
ParameterValue
SeriesS08
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 5.5V
Operating temperature-40°C ~ 85°C (TA)
Speed40MHz
PackageTube
RAM size1K x 8
Core size8-Bit
PeripheralsLVD, POR, PWM, WDT
ConnectivityI²C, LINbus, SCI, SPI
Number of i (O)17
Core processorS08
Case20-TSSOP (0.173\", 4.40mm Width)
Data convertersA/D 12x10b
Program memory size16KB (16K x 8)

Product details

8-bit MCU for cost-sensitive control — 40 MHz, 16 KB Flash, 20-TSSOP

The 20-TSSOP package keeps board area small, and the wide supply range (2.7 V to 5.5 V) lets it sit on a regulated 3.3 V rail or a direct 5 V logic bus without a separate level shifter for the MCU itself. On-chip peripherals include a 12-channel 10-bit ADC, PWM, watchdog timer, and low-voltage detect (LVD) with power-on reset (POR). Connectivity covers I²C, SCI (UART), SPI, and LINbus — enough for a LIN slave node in an automotive body module or a sensor hub in an industrial sensor pod.

The 2.7 V to 5.5 V supply range means this MCU can run directly from a 3.6 V Li-ion cell or a 5 V industrial rail without an external regulator, saving a BOM line. At the low end, 2.7 V is above the typical brownout threshold of a 3.3 V system, so a 3.3 V rail with 5% tolerance (3.135 V min) still holds margin. If the end system sees sustained junction temperatures above 85°C, this part is not the fit — the 85°C ceiling is the absolute operating limit, not a derating target.

Lifecycle — active, no LTB risk

Frequently asked questions

What is the difference between MC9S08SH16CTJ and MC9S08SH16CJ?

The difference is the package and temperature range. The MC9S08SH16CTJ is in a 20-TSSOP package rated for -40°C to 85°C. The MC9S08SH16CJ is in a 20-SOIC package with a -40°C to 85°C range as well. The TSSOP is narrower (4.4 mm body vs 7.5 mm for SOIC), which affects board footprint and thermal dissipation. Functionally they share the same core, memory, and peripheral set.

Can MC9S08SH16CTJ be used as a replacement for MC9S08SH16CJ?

Yes, it can serve as a functional replacement if the board layout accepts the 20-TSSOP footprint. The MC9S08SH16CJ uses a 20-SOIC package (wider body), so the PCB must accommodate the TSSOP land pattern. Electrically the two parts are identical: same 40 MHz core, 16 KB Flash, 1K x 8 RAM, 12-channel ADC, and peripheral set.