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MC9S08QE32CFM

MC9S08QE32CFM NXP 8-bit MCU, 50 MHz, 32 KB Flash, 32-QFN

MPNMC9S08QE32CFM
End of Life

NXP Semiconductors S08 series 8-bit MCU, MC9S08QE32CFM, 50 MHz core, 32 KB Flash, 2K x 8 RAM, 26 I/O, 10-channel 12-bit ADC, 32-VFQFN Exposed Pad, Tray.

$8.2Ref. price · indicative, final on quote
Packaging32-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesS08
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MC9S08QE32CFM specifications
ParameterValue
SeriesS08
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed50MHz
PackageTray
RAM size2K x 8
Core size8-Bit
PeripheralsLVD, PWM, WDT
ConnectivityI²C, LINbus, SCI, SPI
Number of i (O)26
Core processorS08
Case32-VFQFN Exposed Pad
Data convertersA/D 10x12b
Program memory size32KB (32K x 8)

Product details

50 MHz S08 core with 32 KB flash — the processing budget for an 8-bit control loop

The MC9S08QE32CFM runs the S08 core at 50 MHz, giving a 8-bit pipeline enough headroom for sensor polling, PID loops, and communication stack overhead without pushing the clock to its ceiling. 32 KB of on-chip flash (32K x 8) and 2K x 8 RAM hold a moderate application — a motor-control state machine with UART logging, for instance — without external memory.

Industrial temperature grade and 12-bit ADC — sensor-front-end fit

The 10-channel 12-bit ADC resolves analog inputs to 1 mV per LSB at a 3.3 V reference — adequate for thermocouple conditioning (with external gain) or 0-10 V pressure transducer scaling. Connectivity includes I²C, LINbus, SCI (UART), and SPI — the LINbus interface is a differentiator for automotive-adjacent actuator networks where a LIN slave node handles window or mirror positioning.

32-QFN-EP package — board-level integration note

The 0.50 mm pitch QFN pads fan out to inner rows on a two-layer board; a four-layer stack-up with a dedicated ground plane under the exposed pad improves thermal resistance by roughly 20-30% compared to a two-layer pour. Surface-mount assembly with a solder-paste stencil matching the QFN-EP footprint is standard. Moisture sensitivity level (MSL) is typical for this package class; bake before reflow if the shelf-life seal is broken.

Frequently asked questions

What is the maximum clock speed of MC9S08QE32CFM?

The S08 core runs at 50 MHz maximum, which sets the instruction throughput ceiling for the 8-bit pipeline. At this speed, a single-cycle instruction executes in 20 ns.

What is the program memory size and type on MC9S08QE32CFM?

32 KB of on-chip flash memory (32K x 8) for program storage, plus 2K x 8 of RAM for data. The flash is in-system programmable via the SCI or SPI interface.

How can I order MC9S08QE32CFM or check availability?

This active NXP MCU is sourced to order through authorized and independent distribution channels. Submit an RFQ for a firm lead time and lot traceability.