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NXP Semiconductors MC9S08AC16MFJE — Discrete Semiconductors
NXP Semiconductors

NXP MC9S08AC16MFJE 8-bit MCU, 40 MHz, 16 KB Flash, 32-LQFP

MPNMC9S08AC16MFJE
End of Life

NXP S08 8-bit MCU, MC9S08AC16MFJE, 40MHz core, 16KB (16K x 8) FLASH, 1K x 8 RAM, I²C/SCI/SPI, 6x10b ADC, 22 I/O, 2.7V-5.5V, -40°C to 125°C, 32-LQFP (7x7), Tray.

$8.65Ref. price · indicative, final on quote
MC9S08AC16MFJE datasheet
Packaging32-LQFP
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MC9S08AC16MFJE Technical Specifications
ParameterValue
SeriesS08
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.7V ~ 5.5V
Operating temperature-40°C ~ 125°C (TA)
Speed40MHz
PackageTray
RAM size1K x 8
Core size8-Bit
PeripheralsLVD, POR, PWM, WDT
ConnectivityI²C, SCI, SPI
Number of i (O)22
Core processorS08
Case32-LQFP
Data convertersA/D 6x10b
Program memory size16KB (16K x 8)

Product details

What this S08 MCU is and where it fits

The NXP MC9S08AC16MFJE is an 8-bit microcontroller from the S08 family, built around the S08 core. It runs at a 40 MHz bus clock and carries 16 KB of Flash program memory with 1 KB of RAM.

Temperature grade and environment

Rated for -40°C to 125°C ambient, this MCU is built for environments where a commercial-grade part would fail: engine compartments, outdoor telecom cabinets, factory-floor enclosures near motors, or downhole instrumentation. The 32-LQFP package (7x7 mm) is a standard surface-mount footprint, easy to inspect and rework with basic tools — no hot-air station required for a swap if the board has a soldering iron and flux.

40 MHz — what it means for the control loop

The 40 MHz core clock is the headline number for this 8-bit part.

Memory sizing for firmware

16 KB of Flash and 1 KB of RAM fits a modest firmware image: a bootloader, a few communication stacks (I²C slave, SCI Modbus), and a control loop.

Lifecycle and sourcing reality

That means you can design it into new builds without worrying about a last-time-buy window closing. The MC9S08AC16MFJE is ROHS3 compliant.

Frequently asked questions

Can MC9S08AC16MFJE replace MC9S08AC16CJE?

The MC9S08AC16CJE is the commercial-temperature (0°C to 70°C) variant of the same die. The MC9S08AC16MFJE is the industrial-temperature (-40°C to 125°C) version. Electrically and functionally identical — same 40 MHz core, same 16 KB Flash, same 32-LQFP footprint. The MFJE suffix replaces the CJE in any environment that needs the extended temperature range. For a desk-top or climate-controlled application, the CJE is fine; for anything that sees outdoor or under-hood conditions, the MFJE is the correct fit.

What is the lead time for MC9S08AC16MFJE?

Lead time is confirmed at quote time against an RFQ. As an active NXP part, typical independent-distribution lead times range from a few weeks to stock-available, but we do not publish a number here because availability shifts. Submit an RFQ for current lead time and pricing.

Is MC9S08AC16MFJE compatible with a 32-LQFP footprint?

Yes. The MC9S08AC16MFJE is supplied in a 32-LQFP package (7x7 mm body). It fits any standard 32-LQFP land pattern with 0.8 mm pitch. The supplier device package is 32-LQFP (7x7), so the footprint is consistent across the S08AC16 series in this package option.