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NXP Semiconductors 74AUP1G32GF/S708147 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP 74AUP1G32GF/S708147 OR Gate, 0.8-3.6V, 6-XSON

MPN74AUP1G32GF/S708147
End of Life

NXP Semiconductors 74AUP series OR Gate, 74AUP1G32GF/S708147, single 2-input, 0.8V to 3.6V supply, 4mA output drive, 6-XFDFN (6-XSON 1x1) package, Bulk.

$0.18Ref. price · indicative, final on quote
Packaging6-XFDFN
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

74AUP1G32GF/S708147 Technical Specifications
ParameterValue
Series74AUP
Logic typeOR Gate
Mounting typeSurface Mount
Voltage0.8V ~ 3.6V
Current - quiescent500 nA
Current - output high, low4mA, 4mA
Number of inputs2
Operating temperature-40°C ~ 125°C
PackageBulk
Case6-XFDFN
Number of circuits1
Input logic level - low0.7V ~ 0.9V
Input logic level - high1.6V ~ 2V
Max propagation delay @ v, max CL6.4ns @ 3.3V, 30pF

Product details

The 74AUP1G32GF/S708147: Propagation delay is 6.4 ns max at 3.3 V into a 30 pF load — fast enough for general-purpose glue logic in sub-100 MHz digital paths. Output drive is symmetric at 4 mA source and sink, sufficient for driving a single CMOS load or a short PCB trace. Quiescent current maxes at 500 nA across the full supply range, making this gate suitable for battery-powered or always-on blocks where static power dominates.

6-XSON 1x1 — footprint for dense boards

Housed in a 6-XFDFN package (supplier device package 6-XSON, 1 mm x 1 mm), this gate consumes minimal board area. The 0.5 mm pitch and exposed pad require a controlled reflow profile — standard lead-free solder paste with a peak temperature around 260°C works for the package construction. Surface-mount assembly with a 6-pin footprint; the small body means the decoupling capacitor should sit within 2 mm of the supply pin to keep the 500 nA quiescent current clean from switching noise.