LPC5512JBD100E

NXP USA Inc.

NXP LPC5512JBD100E, LPC551x series, ARM Cortex-M33 32-bit single-core MCU, 150MHz, 64KB Flash, 48KB RAM, CAN, USB OTG, Flexcomm, 10x16b SAR ADC, 1.8-3.6V, -40 to 105°C, 100-HLQFP exposed pad, tray.

NXP USA Inc. LPC5512JBD100E
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Technical specifications

LPC5512JBD100E specifications
Parameter / AttributeSpecification / Value
SeriesLPC551x
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed150MHz
PackageTray
RAM size48K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
ConnectivityCANbus, Flexcomm, I²C, SPI, UART/USART, USB
Number of i (O)64
Core processorARM® Cortex®-M33
Case100-LQFP Exposed Pad
Data convertersA/D 10x16b SAR
Program memory size64KB (64K x 8)

Technical details

Flexcomm and USB OTG — one serial peripheral, many protocols

The Flexcomm interface is the standout peripheral: each serial engine can be configured as SPI, I2C, or UART individually, so a single PCB layout covers multiple product variants without changing the MCU footprint. The USB OTG controller handles device, host, and dual-role operation — useful for a field-upgrade tool or a data-logger that plugs into a laptop. The 10-channel 16-bit SAR ADC samples at rates adequate for three-phase current sensing or multi-channel temperature monitoring. The on-chip DMA can shuttle ADC results directly to RAM without CPU intervention, keeping the M33 free for control loops.

LPC5512JBD100E
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