NXP RT1060 crossover MCU, ARM Cortex-M7 528MHz, 196-MAPBGA 10×10mm tray, 3V–3.6V supply, -40°C to 105°C junction, 127 I/O, 1M×8 SRAM, Ethernet, USB OTG, CANbus, 20-ch 12-bit ADC, external QSPI program memory.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | RT1060 |
| Mounting type | Surface Mount |
| Oscillator type | External, Internal |
| Program memory type | External Program Memory |
| Voltage - supply (Vcc (Vdd)) | 3V ~ 3.6V |
| Operating temperature | -40°C~105°C(TJ) |
| Speed | 528MHz |
| Package | Tray |
| RAM size | 1M x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG |
| Number of i (O) | 127 |
| Core processor | ARM® Cortex®-M7 |
| Case | 196-LFBGA |
| Data converters | A/D 20x12b |
Frequently asked questions
Does this MCU require external flash, and what density does NXP recommend for a typical application?
No internal flash is present; the 128KB mask-ROM bootloader boots from an external QSPI device. A 4–16 MB QSPI flash is standard for application codebases in the 2–4 MB range. The exact density is a BOM selection driven by firmware footprint and over-the-air update reserve.
What is the thermal rating, and does it cover enclosed-panel industrial environments?
-40°C to 105°C junction temperature. This handles most cabinet-mounted or enclosed-panel deployments without forced-air cooling, provided the thermal resistance of the 196-MAPBGA package and board layout keeps the die below 105°C under maximum load at the ambient design temperature.
Is the MIMXRT106FCVL5B active and available for new designs?
Active lifecycle with ROHS3 compliance — no EOL or last-time-buy notice in the current record. Quoted to order; submit an RFQ for lead-time and tray MOQ on panel-build quantities.