LPC5528JBD64K
NXP USA Inc.
Surface MountLPC552xTray
Ref. price$8.8500
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NXP USA Inc. LPC55 Series
55 variants · NXP USA Inc.
About the NXP USA Inc. LPC55 Series
The NXP USA Inc. LPC55 Series series groups 55 related part numbers, each listed with full specifications, a datasheet where available, and an RFQ option. The listed variants share a common core processor of ARM® Cortex®-M33, core size of 32-Bit Single-Core and oscillator type of Internal. Variants differ by case, connectivity and data converters, so you can match the exact case your application requires using the selection guide below.
Select a variant by
- Case
- 48-VFQFN Exposed Pad · 64-TQFP Exposed Pad · 100-LQFP Exposed Pad
- Connectivity
- CANBus, Flexcomm, I²C, SPI, UART/USART · CANbus, Flexcomm, I²C, SPI, UART/USART, USB · Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
- Data converters
- A/D 7x16b SAR · A/D 10x16b · A/D 10x16b SAR
- Mounting
- Surface Mount · Surface Mount, Wettable Flank
- Number of i (O)
- 30 · 36 · 64
- Operating temperature
- -40°C ~ 105°C (TA) · -40°C~105°C(TA)
- Package
- Tape & Reel (TR) · Tray
- Peripherals
- Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT · Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Shared specifications
- Core processor
- ARM® Cortex®-M33
- Core size
- 32-Bit Single-Core
- Oscillator type
- Internal
- Program memory type
- FLASH
- Voltage - supply (Vcc (Vdd))
- 1.8V ~ 3.6V
Variant comparison
| Parameter | LPC5528JBD64K | LPC55S26JBD64K | LPC5504JHI48QL | LPC5512JBD100E | LPC55S69JBD100Y |
|---|---|---|---|---|---|
| Case | 64-TQFP Exposed Pad | 64-TQFP Exposed Pad | 48-VFQFN Exposed Pad | 100-LQFP Exposed Pad | 100-LQFP Exposed Pad |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB | CANBus, Flexcomm, I²C, SPI, UART/USART | CANbus, Flexcomm, I²C, SPI, UART/USART, USB | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Data converters | A/D 10x16b | A/D 10x16b | A/D 7x16b SAR | A/D 10x16b SAR | A/D 10x16b |
| Mounting | Surface Mount | Surface Mount | Surface Mount, Wettable Flank | Surface Mount | Surface Mount |
| Number of i (O) | 36 | 36 | 30 | 64 | 64 |
| Operating temperature | -40°C~105°C(TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) | -40°C~105°C(TA) |
| Package | Tray | Tray | Tray | Tray | Tape & Reel (TR) |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT | Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT |
Request a quote on any NXP USA Inc. LPC55 Series part number and we confirm price, availability and lead time per line — including end-of-life and allocation-constrained variants.
