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Micron Technology MT25QL256ABA8E12-0AAT TR — Discrete Semiconductors

Micron MT25QL256ABA8E12-0AAT TR 256Mbit NOR Flash, SPI, AEC-Q100

MPNMT25QL256ABA8E12-0AAT TR
End of Life

Micron MT25QL256ABA8E12-0AAT TR, 256Mbit NOR Flash, SPI Quad I/O, 133 MHz, 2.7V-3.6V, -40°C to 105°C, AEC-Q100, 24-TBGA.

$7.08Ref. price · indicative, final on quote
Packaging24-TBGA
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MT25QL256ABA8E12-0AAT TR specifications
ParameterValue
Memory typeNon-Volatile
MountingSurface Mount
Voltage2.7V ~ 3.6V
Frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 105°C (TA)
GradeAutomotive
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyFLASH - NOR
Memory size256Mbit
Memory formatFLASH
QualificationAEC-Q100
Case24-TBGA
Memory organization32M x 8
Write cycle time - word, page8ms, 2.8ms

Product details

Automotive-grade 256 Mbit NOR Flash with SPI Quad I/O

The Micron MT25QL256ABA8E12-0AAT TR is a 256 Mbit NOR Flash memory organized as 32 M x 8 bits, using the SPI Quad I/O interface for read and program operations. The SPI clock frequency of 133 MHz supports fast code shadowing and data logging, while the supply voltage range of 2.7 V to 3.6 V covers standard logic rails.

What the 133 MHz SPI clock and 256 Mbit density mean for your BOM

The 133 MHz SPI Quad I/O interface delivers a sustained read throughput that keeps a modern MCU's instruction cache fed during execute-in-place (XIP) boot sequences. For a design that shadows firmware to RAM at power-on, the 256 Mbit density holds roughly 32 MB of code — enough for a full-featured AUTOSAR stack or a Linux bootloader. The page program time of 2.8 ms and block erase time of 8 ms are typical for this density class; firmware update strategies should budget for those write latencies. The AEC-Q100 qualification and -40°C to 105°C temperature range are the deciding factors over the commercial-temperature sibling rated only to 85°C.

Package and mounting: 24-TBGA footprint

The part comes in a 24-ball Thin Profile Ball Grid Array (24-T-PBGA) measuring 6 mm x 8 mm. It is a surface-mount package intended for reflow soldering.

This is a production-grade part suitable for BOM freeze in programs with multi-year manufacturing runs. The ROHS3 compliance ensures it meets current environmental regulatory requirements for automotive and industrial markets.

Frequently asked questions

What are the datasheet and specifications for MT25QL256ABA8E12-0AAT TR?

The MT25QL256ABA8E12-0AAT TR is a 256 Mbit NOR Flash memory from Micron with an SPI Quad I/O interface, 133 MHz clock frequency, 2.7 V to 3.6 V supply range, and an operating temperature range of -40°C to 105°C. It is AEC-Q100 qualified and comes in a 24-TBGA package.

What are equivalent parts or cross references for MT25QL256ABA8E12-0AAT TR?

The closest functional peer is the MT25QL256ABA1EW9-0SIT TR, which has the same 256 Mbit density and SPI interface but a commercial temperature range of -40°C to 85°C. For a half-density automotive-grade alternative, the MT25QL128ABA8ESF-0AAT TR offers 128 Mbit with the same AEC-Q100 qualification.

What is the operating temperature range of MT25QL256ABA8E12-0AAT TR?

The operating temperature range is -40°C to 105°C, making it suitable for automotive under-hood and industrial environments where extended temperature tolerance is required.

Is MT25QL256ABA8E12-0AAT TR compatible with 3.3V logic?

Yes, the supply voltage range of 2.7 V to 3.6 V covers the standard 3.3 V logic rail, so the part interfaces directly with 3.3 V MCUs and FPGAs without level shifting.