Micron Technology MT25QU128ABA8E12-0SIT — Logic ICs
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RoHS Compliant · Lead-Free EIA-481 Standard

Micron MT25QU128ABA8E12-0SIT 128Mbit NOR Flash, 133MHz SPI

MPN MT25QU128ABA8E12-0SIT
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Micron Technology MT25QU128ABA8E12-0SIT, 128Mbit FLASH - NOR, SPI - Quad I/O, 133 MHz, 1.7V ~ 2V, -40°C ~ 85°C, 24-TBGA, Tray.

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[SPEC] Essential Parameters Snapshot Full Specifications (13)
Package / Case 24-TBGA
Supply Voltage 1.7V ~ 2V
Speed / Frequency 133 MHz
Memory / RAM 128Mbit

Full Technical Specifications

13 Parameters
MT25QU128ABA8E12-0SIT specifications
Parameter / AttributeSpecification / Value
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage1.7V ~ 2V
Clock frequency133 MHz
Memory interfaceSPI - Quad I/O
Operating temperature-40°C ~ 85°C (TA)
PackageTray
TechnologyFLASH - NOR
Memory size128Mbit
Memory formatFLASH
Case24-TBGA
Memory organization16M x 8
Write cycle time - word, page8ms, 2.8ms
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Technical Details & Description

128Mbit Quad-I/O NOR Flash for 1.8V SPI buses

The Micron MT25QU128ABA8E12-0SIT is a 128Mbit (16M x 8) NOR flash memory that communicates over an SPI bus with Quad I/O support, clocked at up to 133 MHz. This is the part to reach for when a design needs a 1.8V-only serial NOR with the throughput of a quad-lane read — the 133 MHz quad-I/O rate delivers roughly 532 Mbps read bandwidth, enough to shadow-copy code into RAM on a cold boot without waiting on a slower x1 SPI part. The write cycle times are 8 ms for a page program and 2.8 ms for a word program — budget these into the firmware update routine; a full 128 Mbit erase takes several seconds over the quad bus.

Supply rail and temperature grade

This is a strict 1.8 V part — it does not tolerate 3.3 V on VCC, so a separate 1.8 V regulator or a shared rail with other 1.8 V logic is required. ROHS3 compliant per, so it passes the EU RoHS exemption list without lead or restricted halogens — no special handling needed for European or California E-waste regulations.

24-ball TBGA footprint and layout notes

Housed in a 24-ball TBGA (6x8 mm) package, the MT25QU128ABA8E12-0SIT requires a surface-mount footprint with 0.80 mm ball pitch typical for this form factor. The 24-TBGA (6x8) supplier package designation means the die is on a thin substrate with solder balls on the underside — the PCB land pattern must match the Micron recommended footprint for reliable reflow, and the board stack-up should route the SPI signals (CS#, CLK, IO0-IO3) with matched trace lengths to keep skew under 50 ps at 133 MHz. Delivered in tray packaging, not tape-and-reel — this matters for the pick-and-place feeder setup. Tray-fed parts require a tray shaker or manual loading on most assembly lines; confirm the line's tray capability before committing to volume.

Frequently asked questions

Is MT25QU128ABA8E12-0SIT compatible with 1.8V systems?

Yes, the 1.7 V to 2.0 V supply range maps directly to a 1.8 V nominal rail, so it is fully compatible with 1.8 V logic systems. It is not a 3.3 V part.

What is an equivalent or replacement for MT25QU128ABA8E12-0SIT?

The MT25QU128ABA1EW9-0SIT and MT25QU128ABA8ESF-0SIT are other package variants within the same family. The pinout differs between packages, so a board respin is required for a package change.

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