200 MHz Xccela Bus — sustained throughput for XIP
Package and mounting: 24-TBGA (6x8 mm)
The 24-TBGA package with a 6x8 mm body (24-T-PBGA) is a fine-pitch BGA that saves board space compared to a 56-pin TSOP or larger BGA. Surface-mount assembly requires standard BGA reflow profiling; the small ball pitch means the PCB layout should follow Micron's recommended via-in-pad pattern to avoid routing congestion under the package.
